| A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications Z Sun, J Li, M Yu, M Kathaperumal, CP Wong Chemical Engineering Journal, 137319, 2022 | 47 | 2022 |
| Nanocomposites for Future Electronics Device Packaging: A Fundamental Study of Interfacial Connecting Mechanisms and Optimal Conditions of Silane Coupling Agents for … Z Sun, R Wong, M Yu, J Li, M Zhang, L Mele, J Hah, M Kathaperumal, ... Chemical Engineering Journal, 135621, 2022 | 32 | 2022 |
| Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials Z Sun, Y Liu, R Wong, M Yu, J Li, M Moran, M Zhang, S Dahariya, ... Chemical Engineering Journal, 138299, 2022 | 9 | 2022 |
| Large-scale and low-cost production of graphene nanosheets-based epoxy nanocomposites with latent catalyst to enhance thermal conductivity for electronic encapsulation Z Sun, J Li, M Zhang, M Yu, K Moon, C Wong 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 607-612, 2021 | 7 | 2021 |
| Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation Z Sun, M Yu, J Li, M Moran, M Kathaperumal, KS Moon, M Swaminathan, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1282-1286, 2022 | 5 | 2022 |
| Melamine–graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications Z Sun, R Wong, Y Liu, M Yu, J Li, D Spence, M Zhang, M Kathaperumal, ... Nanoscale, 2022 | 4 | 2022 |
| Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications Z Sun, Y Liu, R Wong, M Yu, J Li, M Moran, M Kathaperumal, CP Wong Composites Science and Technology, 109709, 2022 | 4 | 2022 |
| A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device … Z Sun, R Wong, Y Liu, M Yu, J Li, H Liu, D An, M Moran, AM Muslu, ... Composites Science and Technology, 109759, 2022 | 1 | 2022 |
