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Hung Yin LAU
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Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint
S Ismathullakhan, H Lau, Y Chan
Microsystem technologies 19, 1069-1080, 2013
262013
Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0 Ag-0.5 Cu solder alloy
I Shafiq, HY Lau, YC Chan
Journal of electronic materials 42, 2835-2847, 2013
92013
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