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Citations per year
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Since 2019
Citations
35
15
h-index
2
2
i10-index
1
1
0
8
4
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
1
5
3
7
4
5
1
2
5
2
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Co-authors
Y C Chan
City University of Hong Kong
Verified email at cityu.edu.hk
Shafiq.I
City University of Hong Kong
Verified email at my.cityu.edu.hk
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Hung Yin LAU
City University of Hong Kong
Verified email at alumni.cityu.edu.hk -
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Electromagnetic Compatibility
Electronic Packaging
Failure Analysis
Reliability Engineering
Project Management
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Year
Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint
S Ismathullakhan, H Lau, Y Chan
Microsystem technologies 19, 1069-1080
, 2013
26
2013
Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0 Ag-0.5 Cu solder alloy
I Shafiq, HY Lau, YC Chan
Journal of electronic materials 42, 2835-2847
, 2013
9
2013
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