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Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Guoqiang YuInstitute of Physics Chinese Academy of Sciences, UCLAVerified email at iphy.ac.cn
Yabin FanPostdoc at MITVerified email at mit.edu
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
MURONG LANGUCLAVerified email at g.ucla.edu
Juan G AlzateComponent Design Engineer, Advanced Design Team, Intel CorporationVerified email at intel.com
Xufeng KouShanghaiTech UniversityVerified email at shanghaitech.edu.cn
Jianshi TangTsinghua University / IBM Research / UCLAVerified email at tsinghua.edu.cn
Ilya KrivorotovProfessor, University of California at IrvineVerified email at uci.edu
Li-Te ChangElectrical Engineering, UCLAVerified email at g.ucla.edu
Jordan KatineDirector/Technologist, Western Digital Research DivisionVerified email at wdc.com
Mohammad MontazeriIntelVerified email at intel.com
Pedram KhaliliAssociate Professor at Northwestern UniversityVerified email at northwestern.edu
Mustafa AKYOLAssoc. Prof. Dr. of Materials Engineering, AAT Science and Technology UniversityVerified email at atu.edu.tr
Liang HeProfessor, Nanjing University, ChinaVerified email at nju.edu.cn
M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
Qiming ShaoHong Kong University of Science and Technology / UCLA / Tsinghua UniversityVerified email at ust.hk
Sergiy CherepovHGST a Western Digital company, San Jose, CAVerified email at hgst.com
So TakeiQueens College of the City University of New YorkVerified email at qc.cuny.edu
Graham E. RowlandsResearch Scientist, BBN TechnologiesVerified email at raytheon.com
pramey upadhyaya
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