| Effect of different deconvolution methods on structure function calculation KA Pareek, C Grosse, M Sternberg, D May, MA Ras, B Wunderle 2020 26th International Workshop on Thermal Investigations of ICs and …, 2020 | 12 | 2020 |
| Towards data driven failure analysis using infrared thermography KA Pareek, D May, MA Ras, B Wunderle 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics …, 2021 | 8 | 2021 |
| Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data B Wunderle, D May, U Zschenderlein, R Ecke, M Springborn, N Jöhrmann, ... 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 6 | 2018 |
| Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography KA Pareek, D May, P Meszmer, MA Ras, B Wunderle 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 5 | 2022 |
| Towards development of an intelligent failure analysis system based on infrared thermography KA Pareek, D May, MA Ras, B Wunderle Microelectronics Reliability 139, 114823, 2022 | 4 | 2022 |
| Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling M Sternberg, KA Pareek, D May, MA Ras, B Wunderle 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 2 | 2022 |
| Enhancing Defect Detection Using Lock In Thermography D Mohamed, D May, KA Pareek, MA Ras, B Wunderle 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | 1 | 2024 |
| Synthetic data generation using finite element method to pre-train an image segmentation model for defect detection using infrared thermography KA Pareek, D May, P Meszmer, MA Ras, B Wunderle Journal of Intelligent Manufacturing, 1-27, 2024 | | 2024 |
| Thermal Test Vehicle for HPC–System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution M Sternberg, D May, KA Pareek, V Bader, KF Becker, B Wunderle, ... 2023 29th International Workshop on Thermal Investigations of ICs and …, 2023 | | 2023 |
| Development of an Intelligent Failure Analysis System Based on Infrared Thermography and Finite Element Modelling Supported Data Augmentation for Deep Learning KA Pareek, D May, P Meszmer, MA Ras, B Wunderle | | |
