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Huxiao Xie
Huxiao Xie
在 asu.edu 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Fabrication of Ag/polypyrrole coaxial nanocables through common ions adsorption effect
A Chen, H Xie, H Wang, H Li, X Li
Synthetic Metals 156 (2-4), 346-350, 2006
682006
Mechanical properties of intermetallic inclusions in Al 7075 alloys by micropillar compression
SS Singh, E Guo, H Xie, N Chawla
Intermetallics 62, 69-75, 2015
652015
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
KE Yazzie, HX Xie, JJ Williams, N Chawla
Scripta Materialia 66 (8), 586-589, 2012
652012
Mechanical characterization of microconstituents in a cast duplex stainless steel by micropillar compression
EY Guo, HX Xie, SS Singh, A Kirubanandham, T Jing, N Chawla
Materials Science and Engineering: A 598, 98-105, 2014
592014
Electromigration damage characterization in Sn-3.9 Ag-0.7 Cu and Sn-3.9 Ag-0.7 Cu-0.5 Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy
HX Xie, D Friedman, K Mirpuri, N Chawla
Journal of electronic materials 43, 33-42, 2014
422014
Mechanical shock behavior of Sn–3.9 Ag–0.7 Cu and Sn–3.9 Ag–0.7 Cu–0.5 Ce solder joints
HX Xie, N Chawla
Microelectronics Reliability 53 (5), 733-740, 2013
232013
Thermal and mechanical stability of Ce-containing Sn-3.9 Ag-0.7 Cu lead-free solder on Cu and electroless Ni-P metallizations
H Xie, N Chawla, K Mirpuri
Journal of electronic materials 41, 3249-3258, 2012
232012
Orientation dependence of indentation behavior in Al–SiC nanolaminate composites
C Mayer, LW Yang, SS Singh, H Xie, YL Shen, J Llorca, ...
Materials Letters 168, 129-133, 2016
192016
The synthesis of Ag/polypyrrole coaxial nanocables via ion adsorption method using different oxidants
T Qiu, H Xie, J Zhang, A Zahoor, X Li
Journal of Nanoparticle Research 13, 1175-1182, 2011
192011
Mechanisms of deformation in high-ductility Ce-containing Sn–Ag–Cu solder alloys
HX Xie, N Chawla, YL Shen
Microelectronics Reliability 51 (6), 1142-1147, 2011
182011
Microstructurebased modeling of deformation in steels based on constitutive relationships from micropillar compression
EY Guo, SS Singh, H Xie, JJ Williams, T Jing, N Chawla
steel research international 85 (6), 946-953, 2014
132014
Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9 Ag-0.7 Cu Pb-free solder alloys
HX Xie, L Jiang, N Chawla
Journal of Materials Science: Materials in Electronics 24, 3456-3466, 2013
122013
Enhancing the ductility of Sn-Ag-Cu lead-free solder joints by addition of compliant intermetallics
HX Xie, N Chawla
Journal of electronic materials 42, 527-536, 2013
112013
Tensile behavior of single-crystal tin whiskers
SS Singh, R Sarkar, HX Xie, C Mayer, J Rajagopalan, N Chawla
Journal of electronic materials 43, 978-982, 2014
72014
Fabrication of Ag/Polypyrrole (PPy) Coaxial Nanocables Through Ions Adsorption Method
HX XIE, T QIU, XY LI
CHEMICAL JOURNAL OF CHINESE UNIVERSITIES, 2008
2*2008
Properties of Cerium Containing Lead Free Solder
H Xie
Arizona State University, 2012
2012
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