| Plasma deposition—Impact of ions in plasma enhanced chemical vapor deposition, plasma enhanced atomic layer deposition, and applications to area selective deposition C Vallée, M Bonvalot, S Belahcen, T Yeghoyan, M Jaffal, R Vallat, ... Journal of Vacuum Science & Technology A 38 (3), 2020 | 41 | 2020 |
| Evolution of crystal structure during the initial stages of ZnO atomic layer deposition R Boichot, L Tian, MI Richard, A Crisci, A Chaker, V Cantelli, S Coindeau, ... Chemistry of Materials 28 (2), 592-600, 2016 | 41 | 2016 |
| Understanding the mechanisms of interfacial reactions during TiO2 layer growth on RuO2 by atomic layer deposition with O2 plasma or H2O as oxygen source A Chaker, PD Szkutnik, J Pointet, P Gonon, C Vallée, A Bsiesy Journal of Applied Physics 120 (8), 2016 | 24 | 2016 |
| An atomistic view of the incipient growth of zinc oxide nanolayers MH Chu, L Tian, A Chaker, V Cantelli, T Ouled, R Boichot, A Crisci, S Lay, ... Crystal Growth & Design 16 (9), 5339-5348, 2016 | 18 | 2016 |
| Nanoscale patterning of zinc oxide from zinc acetate using electron beam lithography for the preparation of hard lithographic masks A Chaker, HR Alty, P Tian, A Kotsovinos, GA Timco, CA Muryn, SM Lewis, ... ACS Applied Nano Materials 4 (1), 406-413, 2020 | 16 | 2020 |
| Topographically selective deposition A Chaker, C Vallée, V Pesce, S Belahcen, R Vallat, R Gassilloud, ... Applied Physics Letters 114 (4), 2019 | 16 | 2019 |
| Controlling the Current Conduction Asymmetry of HfO2 Metal–Insulator–Metal Diodes by Interposing Al2O3 Layer W Jeon, O Salicio, A Chaker, P Gonon, C Vallée IEEE Transactions on Electron Devices 66 (1), 402-406, 2018 | 13 | 2018 |
| Control of ion energy during plasma enhanced atomic layer deposition: A new strategy for the modulation of TiN growth delay on SiO2 S Belahcen, C Vallée, A Bsiesy, A Chaker, M Jaffal, T Yeghoyan, ... Journal of Vacuum Science & Technology A 39 (1), 2021 | 9 | 2021 |
| High capacitance density of 185 nF/mm2 achieved in three-dimensional MIM structures using TiO2 as a dielectric A Chaker, P Gonon, C Vallée, A Bsiesy Applied Physics Letters 110 (24), 2017 | 9 | 2017 |
| Evaluation of Alternative Atomistic Models for the Incipient Growth of ZnO by Atomic Layer Deposition MH Chu, L Tian, A Chaker, E Skopin, V Cantelli, T Ouled, R Boichot, ... Journal of Electronic Materials 46, 3512-3517, 2017 | 9 | 2017 |
| Wide Band Frequency Characterization of Al-Doped and Undoped Rutile TiO2 Thin Films for MIM Capacitors A Chaker, C Bermond, P Artillan, P Gonon, C Vallée, A Bsiesy IEEE Electron Device Letters 38 (3), 375-378, 2017 | 7 | 2017 |
| Negative Tone Metallic Organic Resists with Improved Sensitivity for Plasma Etching: Implications for Silicon Nanostructure Fabrication and Photomask Production A Chaker, HA Alty, P Winpenny, GFS Whitehead, GA Timco, SM Lewis, ... ACS Applied Nano Materials 5 (12), 17538-17543, 2022 | 1 | 2022 |
| Understanding the mechanisms of interfacial reactions during TiO {sub 2} layer growth on RuO {sub 2} by atomic layer deposition with O {sub 2} plasma or H {sub 2} O as oxygen … A Chaker, PD Szkutnik, J Pointet, P Gonon, C Vallée Journal of Applied Physics 120 (8), 2016 | 1 | 2016 |
| Method for forming spacers of a transistor N Posseme, M Bonvalot, A Chaker, C Vallee US Patent 11,393,689, 2022 | | 2022 |
| High k Dielectrics for MIM Architecture: From Capacitors to Non-volatile Memories Applications C Vallée, P Gonon, W Jeona, M Saadi, C Mannequin, T Wakrim, C Nail, ... ICMCTF 2021-47th International Conference On Metallurgical Coatings & Thin Films, 2021 | | 2021 |
| Top and Bottom Ta2O5 Topographical Selective Deposition on 3D structures by Plasma Enhanced Atomic Layer Deposition T Yeghoyan, M Jaffal, V Pesce, G Lefevre, A Chaker, S David, ... 7th International Atomic Layer Etching Workshop (ALE 2020), 2020 | | 2020 |
| Topographic Area Selective Deposition (TSD): a comparison between PEALD/q-ALE and PEALD/sputtering approaches M Jaffal, T Yeghoyan, V Pesce, G Lefevre, A Chaker, S David, ... 7th International Atomic Layer Etching Workshop (ALE 2020), 2020 | | 2020 |
| (Invited) PEALD and ALE for Area Selective Deposition C Vallée, M Bonvalot, R Gassilloud, V Pesce, A Chaker, S Belahcen, ... Electrochemical Society Meeting Abstracts 236, 1139-1139, 2019 | | 2019 |
| Method for corming spacers of a transistor A Chaker, M Bonvalot, C Vallée, N Possémé | | 2019 |
| Single batch strategies for the development of an Area Selective Deposition process with the deposition/etch approach C Vallee, M Bonvalot, R Gassilloud, V Pesce, A Chaker, S Belahcen, ... 19th International Conference on Atomic layer Deposition (ALD2019), 2019 | | 2019 |
