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合著作者
- Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor在 stanford.edu 的电子邮件经过验证
- Mehdi AsheghiAdjunct Professor of Mechanical Engineerig, Stanford University在 stanford.edu 的电子邮件经过验证
- Gang ChenProfessor, Mechanical Engineering, massachusetts institute of technology在 mit.edu 的电子邮件经过验证
- Namiko YamamotoPenn State University在 psu.edu 的电子邮件经过验证
- Rajath KantharajMechanical Engineer, Intel Corporation在 intel.com 的电子邮件经过验证
- Hadi GhasemiUniversity of Houston, MIT, UofT在 uh.edu 的电子邮件经过验证
- George NiMIT在 mit.edu 的电子邮件经过验证
- Albraa A. AlsaatiPurdue University在 purdue.edu 的电子邮件经过验证
- Michael T BarakoSenior Staff Scientist, NG Next Basic Research Laboratory, Northrop Grumman Space Systems在 NorthropGrummanNext.net 的电子邮件经过验证
- Justin A. WeibelPurdue University在 purdue.edu 的电子邮件经过验证
- Nenad MiljkovicUniversity of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- Yuqiang ZengSouthern University of Science and Technology. (Previously LBNL & Purdue University)在 sustech.edu.cn 的电子邮件经过验证
- Selcuk YerciElectrical and Electronics Engineering, ODTU-GUNAM, METU在 metu.edu.tr 的电子邮件经过验证
- Woosung ParkMechanical Engineering, Sogang University在 sogang.ac.kr 的电子邮件经过验证
- Brian L. WardleProfessor of Aeronautics and Astronautics, Massachusetts Institute of Technology在 MIT.EDU 的电子邮件经过验证
- Hai M. DuongAssoc Professor, Mechanical Engineering, National University of Singapore (NUS)在 nus.edu.sg 的电子邮件经过验证
- Yuan GaoLieber Institute for Brain Development/Department of Biomedical Engineering, Johns Hopkins在 libd.org 的电子邮件经过验证
- Aaditya CandadaiPackaging R&D Engineer, Intel Corporation在 intel.com 的电子邮件经过验证
- Ali ShakouriProfessor of Electrical and Computer Engineering, Purdue University在 purdue.edu 的电子邮件经过验证
- Takashi KodamaProfessor of Mechanical and Control Engineering Dept., Kyushu Institute of Technology在 mail.kyutech.jp 的电子邮件经过验证