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| Sintered nanocopper paste for high-performance 3D heterogeneous package integration Y Wang, AO Watanabe, N Ogura, PM Raj, R Tummala Journal of Electronic Materials 49, 6737-6745, 2020 | 14 | 2020 |
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| 8.1 μm-emitting InP-based quantum cascade laser grown on Si by metalorganic chemical vapor deposition LJM S. Xu, S. Zhang, J. D. Kirch, H. Gao, Y. Wang, M. L. Lee, R. Tatavarti ... Applied Physics Letters 123 (3), 031110, 2023 | 6 | 2023 |
