| Removal of Trace Pharmaceuticals from Water using coagulation and powdered activated carbon as pretreatment to ultrafiltration membrane system C Sheng, AGA Nnanna, Y Liu, JD Vargo Science of the Total Environment 550, 1075-1083, 2016 | 156 | 2016 |
| Near-junction cooling for next-generation power electronics F Zhou, SN Joshi, Y Liu, EM Dede International communications in heat and mass transfer 108, 104300, 2019 | 38 | 2019 |
| Modular design for a single-phase manifold mini/microchannel cold plate F Zhou, Y Liu, Y Liu, SN Joshi, EM Dede Journal of Thermal Science and Engineering Applications 8 (2), 021010, 2016 | 29 | 2016 |
| Design, fabrication, and performance evaluation of a hybrid wick vapor chamber F Zhou, Y Liu, EM Dede Journal of Heat Transfer 141 (8), 081802, 2019 | 28 | 2019 |
| X‐ray microtomography of thermal cycling damage in sintered nano‐silver solder joints IL Regalado, JJ Williams, S Joshi, EM Dede, Y Liu, N Chawla Advanced Engineering Materials 21 (3), 1801029, 2019 | 27 | 2019 |
| SiC MOSFET-based power module design and analysis for EV traction systems E Gurpinar, R Wiles, B Ozpineci, T Raminosoa, F Zhou, Y Liu, EM Dede 2018 IEEE energy conversion congress and exposition (ECCE), 1722-1727, 2018 | 24 | 2018 |
| Integration of augmented reality with computational fluid dynamics for power plant training J Moreland, J Wang, Y Liu, F Li, L Shen, B Wu, C Zhou Proceedings of the International Conference on Modeling, Simulation and …, 2013 | 19 | 2013 |
| Optimal design of three-dimensional heat flow structures for power electronics applications EM Dede, Y Liu, SN Joshi, F Zhou, DJ Lohan, JW Shin Journal of Thermal Science and Engineering Applications 11 (2), 021011, 2019 | 17 | 2019 |
| Novel transient liquid phase bonding for high-temperature automotive power electronics systems Y Liu, SN Joshi, EM Dede Journal of Electronic Packaging 142 (1), 011003, 2020 | 15 | 2020 |
| Vapor chamber with thermal diode and switch functions F Zhou, Y Liu, SN Joshi, EM Dede, X Chen, JA Weibel 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 13 | 2017 |
| Multi-pad receivers for high power dynamic wireless power transfer BJ Varghese, RA Zane, A Kamineni, R Tavakoli, Z Pantic, C Chou, L Liu 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 5162-5168, 2020 | 12 | 2020 |
| A review of select patented technologies for cooling of high heat flux power semiconductor devices SN Joshi, F Zhou, Y Liu, DJ Lohan, H Ukegawa, J Lee, EM Dede IEEE Transactions on Power Electronics, 2023 | 10 | 2023 |
| Electrothermal Circuit Design With Heat Flow Control—Synchronous Buck Converter Case Study EM Dede, CM Wang, Y Liu, P Schmalenberg, F Zhou, JW Shin, M Ishigaki IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (2 …, 2017 | 8 | 2017 |
| Effect of component flexibility during thermal cycling of sintered nano-silver joints by X-ray microtomography JJ Williams, IL Regalado, L Liu, S Joshi, N Chawla Journal of Electronic Materials 49, 241-244, 2020 | 6 | 2020 |
| Modular flow structure design for a single-phase manifold microchannel cold plate F Zhou, Y Liu, SN Joshi, Y Liu, EM Dede International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 5 | 2015 |
| Multi-layer design and power transfer test of PCB-based coil for electric vehicle wireless charging Y Liu, A Kamineni, H Ukegawa, EM Dede, JS Lee 2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), 1-5, 2023 | 4 | 2023 |
| Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies SN Joshi, S Suenaga, Y Liu US Patent 10,945,333, 2021 | 4 | 2021 |
| High frequency AC power distribution network for electric vehicle auxiliary electrical system Q Wu, M Wang, W Zhou, Y Liu 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 891-896, 2020 | 4 | 2020 |
| Low temperature sintering porous metal foam layers for enhanced cooling and processes for forming thereof SN Joshi, Y Liu US Patent 10,794,642, 2020 | 3 | 2020 |
| Reliability of laminated bond structure using (Cu, Ni)/Sn TLP bonding with Al interlayer for high temperature power electronics packaging Y Liu, SN Joshi, EM Dede 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1437-1442, 2019 | 3 | 2019 |
