| Characterization of ABF/glass/ABF substrates for mmWave applications M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 31 | 2021 |
| W-band and D-band transmission lines on glass based substrates for sub-THz modules M ur Rehman, S Ravichandran, S Erdogan, M Swaminathan 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 660-665, 2020 | 23 | 2020 |
| Material design and high frequency characterization of novel ultra-low loss dielectric material for 5G and 6G applications T Kakutani, Y Suzuki, M Koh, S Sekiguchi, S Matsumura, K Oki, S Mishima, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 538-543, 2021 | 16 | 2021 |
| Characterization of chip-to-package interconnects for glass panel embedding (GPE) for sub-THz wireless communications S Erdogan, S Ravichandran, X Jia, M Swaminathan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2328-2333, 2021 | 10 | 2021 |
| Accelerating the co-simulation method for the design of transmit array coils for MRI A Sadeghi-Tarakameh, E Kazemivalipour, U Gundogdu, S Erdogan, ... Magnetic Resonance Materials in Physics, Biology and Medicine 34, 165-178, 2021 | 8 | 2021 |
| Antenna with embedded die in glass interposer for 6g wireless applications X Jia, X Li, S Erdogan, KS Moon, JW Kim, KQ Huang, MB Jordan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 6 | 2023 |
| Integrated and miniaturized quasi Yagi D-band antenna in glass interposer S Erdogan, KSJ Moon, M Kathaperumal, M Swaminathan 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 687-690, 2022 | 6 | 2022 |
| D-band Quasi-Yagi antenna in glass-based package S Erdogan, M Swaminathan 2021 IEEE MTT-S International Microwave and RF Conference (IMARC), 1-4, 2021 | 5 | 2021 |
| Packaging approaches for mm wave and sub-THz communication S Ravichandran, KQ Huang, M ur Rehman, S Erdogan, A Watanabe, ... 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019 | 5 | 2019 |
| Reliability and High-Frequency Filter Characteristics of a Low-Loss Material for 5G RF Modules T Kakutani, Y Suzuki, M Ali, S Erdogan, M Kathaperumal, M Swaminathan 2020 International Symposium on Semiconductor Manufacturing (ISSM), 1-4, 2020 | 2 | 2020 |
| Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits P Vanna-Iampikul, L Zhu, S Erdogan, M Kathaperumal, R Agarwal, ... 2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6, 2023 | 1 | 2023 |
| D-Band Integrated and Miniaturized Quasi Yagi Antenna Array in Glass Interposer S Erdogan, KSJ Moon, M Kathaperumal, M Swaminathan IEEE Transactions on Terahertz Science and Technology, 2023 | 1 | 2023 |
| Advanced Low Df Dry film Build-up Material on Glass panel for 5G application T Kakutani, Z Guan, Y Suzuki, M Ali, S Erdogan, A Watanabe, ... International Symposium on Microelectronics 2020 (1), 000201-000205, 2020 | 1 | 2020 |
| Air Filled SIWs using Laminate Dielectrics on Glass Substrate for D-band Applications M ur Rehman, LNV Kumar, S Erdogan, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications O Akinwande, S Erdogan, R Kumar, M Swaminathan IEEE Transactions on Microwave Theory and Techniques, 2023 | | 2023 |
| Design and Characterization of Metalized Trench Based Waveguide Technology on Glass Interposer for 6G Applications X Li, X Jia, S Erdogan, M Jordan, M Swaminathan 2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 684-687, 2023 | | 2023 |
| Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications X Li, X Jia, S Erdogan, M Swaminathan 2023 IEEE Radio and Wireless Symposium (RWS), 98-100, 2023 | | 2023 |
| Package Design and Measurements for Radar Emulator using Accelerators and Photonics M Daniel-Aguebor, MU Rehman, S Erdogan, KSJ Moon, N Ambasana, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1342-1348, 2022 | | 2022 |
| HIPR-RF Hetergeneous Integration for Parasitic Loss in RF Microsystems. C Nyon, S Erdogan, S Ravichandran, M Jordan, C Nordquist, ... Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2021 | | 2021 |
| SPECIAL ISSUE ON THE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM Y Zeng, M Yu, O Akinwande, S Erdogan, R Kumar, M Swaminathan, ... | | |
