| Modeling strategy for EMI filters R He, Y Xu, S Walunj, S Yong, V Khilkevich, D Pommerenke, HL Aichele, ... IEEE Transactions on Electromagnetic Compatibility 62 (4), 1572-1581, 2020 | 36 | 2020 |
| Dielectric loss tangent extraction using modal measurements and 2-D cross-sectional analysis for multilayer PCBs S Yong, V Khilkevich, Y Liu, H Gao, S Hinaga, S De, D Padilla, ... IEEE Transactions on Electromagnetic Compatibility 62 (4), 1278-1292, 2020 | 33 | 2020 |
| Mechanical magnetic field generator for communication in the ULF range H Rezaei, V Khilkevich, S Yong, DS Stutts, D Pommerenke IEEE Transactions on Antennas and Propagation 68 (3), 2332-2339, 2019 | 33 | 2019 |
| Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and Via pairs by using design of experiments (DoE) method B Chen, M Ouyang, S Yong, Y Wang, Y Bai, Y Zhou, J Fan Electromagnetic Compatibility (EMC), 2017 IEEE International Symposium, 2017 | 30* | 2017 |
| Differential crosstalk mitigation in the pin field area of serdes channel with trace routing guidance B Chen, S Pan, J Wang, S Yong, M Ouyang, J Fan IEEE Transactions on Electromagnetic Compatibility 61 (4), 1385-1394, 2019 | 29 | 2019 |
| Comprehensive and practical way to look at far-end crosstalk for transmission lines with lossy conductor and dielectric S Yong, V Khilkevich, XD Cai, C Sui, B Sen, J Fan IEEE Transactions on Electromagnetic Compatibility 62 (2), 510-520, 2019 | 26 | 2019 |
| Passive intermodulation source localization based on emission source microscopy S Yong, S Yang, L Zhang, X Chen, DJ Pommerenke, V Khilkevich IEEE Transactions on Electromagnetic Compatibility 62 (1), 266-271, 2019 | 24 | 2019 |
| S-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures Y Liu, S Yong, H Gao, S Hinaga, D Padilla, D Yanagawa, JL Drewniak, ... IEEE Transactions on Electromagnetic Compatibility 62 (4), 1459-1467, 2020 | 21 | 2020 |
| Dielectric dissipation factor (DF) extraction based on differential measurements and 2-D cross-sectional analysis S Yong, Y Liu, H Gao, B Chen, S De, S Hinaga, D Yanagawa, J Drewniak, ... 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 21 | 2018 |
| Automatic sparse ESM scan using Gaussian process regression J Li, J Zhou, S Yong, Y Liu, V Khilkevich 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 19 | 2020 |
| A practical de-embedding error analysis method based on statistical circuit models of fixtures S Yong, Y Liu, H Gao, S Hinaga, S De, D Padilla, D Yanagawa, ... 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 17 | 2019 |
| A comprehensive and practical way to look at crosstalk for transmission lines with mismatched terminals S Yong, K Cai, B Sen, J Fan, V Khilkevich, C Sui 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 17 | 2018 |
| A cross-sectional profile based model for stripline conductor surface roughness S Yong, V Khilkevich, Y Liu, R He, Y Guo, H Gao, S Hinaga, D Padilla, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 13 | 2020 |
| Limitations of first-order surface impedance boundary condition and its effect on 2D simulations for PCB transmission lines Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 12 | 2020 |
| An empirical modeling of far-end crosstalk and insertion loss in microstrip lines Y Liu, S Yong, Y Guo, J He, C Li, X Ye, J Fan, V Khilkevich, DH Kim IEEE Transactions on Signal and Power Integrity 1, 130-139, 2022 | 10 | 2022 |
| Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent Y Guo, S Yong, Y Liu, J He, B Pu, X Ye, A Sutono, V Kunda, A Luoh, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 820-824, 2021 | 10 | 2021 |
| Prepreg and Core Dielectric Permittivity (ϵr) Extraction for Fabricated Striplines’ Far-End Crosstalk Modeling S Yong, S Penugonda, DH Kim, V Khilkevich, B Pu, X Ye, Q Gao, XD Cai, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 209-218, 2021 | 9 | 2021 |
| Dielectric Material and Foil Surface Roughness Properties Extraction Based on Single-ended Measurements and Phase Constant () Fitting S Yong, V Khilkevich, S Penugonda, XD Cai, Q Gao, B Sen, H Gao, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 9 | 2020 |
| The simulated TDR impedance in PCB material characterization Y Guo, DH Kim, J He, S Yong, Y Liu, B Pu, X Ye, J Fan 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 831-834, 2021 | 8 | 2021 |
| Far-end crosstalk analysis for stripline with inhomogeneous dielectric layers (IDL) Y Liu, S Yong, Y Guo, J He, L Liu, N Kutheis, A Sutono, V Kunda, A Luoh, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 825-830, 2021 | 8 | 2021 |
Yuanzhuo LiuMissouri University S&TVerified email at mst.edu
