| Through silicon via reliability C Cassidy, J Kraft, S Carniello, F Roger, H Ceric, AP Singulani, E Langer, ... IEEE Transactions on Device and Materials Reliability 12 (2), 285-295, 2012 | 70 | 2012 |
| Electro-thermal-mechanical modeling of gas sensor hotplates R Coppeta, A Lahlalia, D Kozic, R Hammer, J Riedler, G Toschkoff, ... Sensor Systems Simulations: From Concept to Solution, 17-72, 2020 | 14 | 2020 |
| Intrinsic stress analysis of tungsten-lined open TSVs L Filipovic, AP Singulani, F Roger, S Carniello, S Selberherr Microelectronics Reliability 55 (9-10), 1843-1848, 2015 | 14 | 2015 |
| Computational intelligence applied to the growth of quantum dots AP Singulani, OPV Neto, MCA Pacheco, MBR Vellasco, MP Pires, ... Journal of Crystal Growth 310 (23), 5063-5065, 2008 | 12 | 2008 |
| LU decomposition on GPUs: The impact of memory access LF Cupertino, AP Singulani, CP da Silva, MAC Pacheco, R Farias 2010 22nd International Symposium on Computer Architecture and High …, 2010 | 10 | 2010 |
| Global statistical methodology for the analysis of equipment parameter effects on TSV formation F Roger, A Singulani, S Carniello, L Filipovic, S Selberherr 2015 International Workshop on CMOS Variability (VARI), 39-44, 2015 | 9 | 2015 |
| Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology AP Singulani, H Ceric, E Langer, S Carniello 2013 IEEE International Reliability Physics Symposium (IRPS), CP. 2.1-CP. 2.5, 2013 | 9 | 2013 |
| Advanced methods for mechanical analysis and simulation of through silicon vias AP Singulani Ph. D. thesis, Technischen Universität Wien, 2014 | 8 | 2014 |
| Stress evolution in the metal layers of TSVs with Bosch scallops AP Singulani, H Ceric, S Selberherr Microelectronics Reliability 53 (9-11), 1602-1605, 2013 | 8 | 2013 |
| Thermo-mechanical simulations of an open tungsten TSV AP Singulani, H Ceric, S Selberherr 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 107-111, 2012 | 8 | 2012 |
| Single particle detector using the evanescent field of a silicon nitride waveguide A Buchberger, P Maierhofer, A Bergmann, A Singulani, M Sagmeister, ... 2019 IEEE SENSORS, 1-4, 2019 | 6 | 2019 |
| Effects of sidewall scallops on open tungsten TSVs L Filipovic, RL de Orio, S Selberherr, A Singulani, F Roger, R Minixhofer 2014 IEEE International Reliability Physics Symposium, 3E. 3.1-3E. 3.6, 2014 | 6 | 2014 |
| Simulating particle influence on silicon nitride strip waveguide single-mode parameters M Baumgart, J Pribošek, A Buchberger, A Singulani, A Tortschanoff Fourth International Conference on Applications of Optics and Photonics …, 2019 | 5 | 2019 |
| Self-assembly quantum dots growth prediction by quantum-inspired linear genetic programming DM Dias, AP Singulani, MAC Pacheco, PL de Souza, MP Pires, OPV Neto 2011 IEEE Congress of Evolutionary Computation (CEC), 2075-2082, 2011 | 5 | 2011 |
| Silicon nitride photonic particle detector—experiments and model assessment A Buchberger, P Maierhofer, F Stollberger, A Singulani, M Sagmeister, ... IEEE Sensors Journal 21 (17), 18829-18836, 2021 | 4 | 2021 |
| Impact of intermetallic compound on solder bump electromigration reliability H Ceric, AP Singulani, RL De Orio, S Selberherr 2013 International Conference on Simulation of Semiconductor Processes and …, 2013 | 4 | 2013 |
| Impact of bosch scallops dimensions on stress of an open through Silicon Via technology AP Singulani, H Ceric, L Filipovic, E Langer 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | 4 | 2013 |
| Stress evolution on tungsten thin-film of an open through silicon via technology AP Singulani, H Ceric, E Langer Proceedings of the 20th IEEE International Symposium on the Physical and …, 2013 | 3 | 2013 |
| Integrated particulate matter sensor systems H Etschmaier, G Roehrer, A Singulani, A Bergmann US Patent 11,536,640, 2022 | 2 | 2022 |
| Characterization of moisture uptake in microelectronics packaging materials F Huber, H Etschmaier, A Wolfberger, A Singulani, P Hadley 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-7, 2018 | 2 | 2018 |
