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Sangeon Lee
Sangeon Lee
Staff Engineer at Intel Corporation
Verified email at umich.edu
Title
Cited by
Cited by
Year
Highly stretchable or transparent conductor fabrication by a hierarchical multiscale hybrid nanocomposite
P Lee, J Ham, J Lee, S Hong, S Han, YD Suh, S Lee, J Yeo, SS Lee, ...
Advanced Functional Materials 24 (36), 5671-5678, 2014
3412014
High‐performance flexible transparent electrode with an embedded metal mesh fabricated by cost‐effective solution process
A Khan, S Lee, T Jang, Z Xiong, C Zhang, J Tang, LJ Guo, WD Li
Small 12 (22), 3021-3030, 2016
2122016
Superamphiphobic surface by nanotransfer molding and isotropic etching
S Lee, HJ Kim, SH Lee, DG Choi
Langmuir 29 (25), 8070-8075, 2013
782013
Highly robust silicon nanowire/graphene core–shell electrodes without polymeric binders
S Lee, HJ Kim, H Kim, JH Park, DG Choi
Nanoscale 5 (19), 8986-8991, 2013
392013
Mass-producible superhydrophobic surfaces
S Lee, KW Lee, JH Kim, KC Lee, SS Lee, SU Hong
Chemical Communications 47 (43), 12005-12007, 2011
222011
Gold-coated silicon nanowire–graphene core–shell composite film as a polymer binder-free anode for rechargeable lithium-ion batteries
HJ Kim, S Lee, J Lee, JY Jung, ES Lee, JH Choi, JH Jung, M Oh, S Hyun, ...
Physica E: Low-dimensional Systems and Nanostructures 61, 204-209, 2014
212014
Polymer‐free Vertical Transfer of Silicon Nanowires and their Application to Energy Storage
HJ Kim, J Lee, S Lee, W Kim, HJ Kim, DG Choi, JH Park
ChemSusChem 6 (11), 2144-2148, 2013
152013
Flexible Superhydrophobic Polymeric Surfaces with Micro‐/Nanohybrid Structures Using Black Silicon
S Lee, D Lee, P Lee, SH Ko, SS Lee, SU Hong
Macromolecular Materials and Engineering 298 (3), 311-317, 2013
132013
Embossed superhydrophobic polymer surfaces with topological variances
S Lee, HG Lim, SS Lee, DG Choi, D Lee, SU Hong
Macromolecular Research 21 (8), 916-920, 2013
122013
Optimized optical/electrical/mechanical properties of ultrathin metal films for flexible transparent conductor applications: review
YB Park, S Lee, M Tobah, T Ma, LJ Guo
Optical Materials Express 13 (2), 304-347, 2023
82023
Bioinspired toughening mechanisms in a multilayer transparent conductor structure
S Lee, LJ Guo
ACS Applied Materials & Interfaces 14 (5), 7440-7449, 2022
72022
Scalable solution-processed fabrication strategy for high-performance, flexible, transparent electrodes with embedded metal mesh
A Khan, S Lee, T Jang, Z Xiong, C Zhang, J Tang, LJ Guo, WD Li
JoVE (Journal of Visualized Experiments), e56019, 2017
22017
Mechanical properties of Metal Based Flexible Transparent Conductive Electrode: From Fracture Mechanics perspective
S Lee
University of Michigan, 2019
12019
Food packing material having hydrophobicity, manufacturing method and mold thereof
JH Lee, KS Jo, SW Lee, MY Park, S Lee, KW Lee, JH Kim, HK Lim, ...
US Patent 9,427,923, 2016
12016
Food packing material having hydrophobicity, manufacturing method and mold thereof
S Lee
EP Patent App. EP2734454A4, 2015
12015
Transparent and flexible conductors made by additive processes
LJ Guo, T Jang, S Lee, J Lee
US Patent 11,217,358, 2022
2022
Food packaging material having uniform coating of oil
S Lee
US Patent 20,190,022,899, 2019
2019
Mold for manufacturing a food packaging material having uniform coating of oil
S Lee
US Patent 10,105,873, 2018
2018
Forming method of graphene pattern layer, fabrication method of structure having graphene pattern layer
이승섭, 고승환, 이동진, 이상은
KR Patent 101,274,125, 2017
2017
具有嵌入式金属网的高性能, 灵活, 透明电极的可扩展解决方案处理制造策略
A Khan, S Lee, T Jang, Z Xiong, C Zhang, J Tang, LJ Guo, WD Li
2017
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