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Co-authors
Jun ZhangAssistant Professor, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Pingyi FanProfessor of Electronic Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
Ross MurchChair Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
Roger S ChengHKUSTVerified email at ust.hk
Wei ChenProfessor, Dept. EE, Tsinghua UniversityVerified email at tsinghua.edu.cn
SH SongThe Hong Kong University of Science and TechnologyVerified email at ust.hk
Yuanming ShiShanghaiTech UniversityVerified email at shanghaitech.edu.cn
Ke XiongBeijing Jiaotong UniversityVerified email at bjtu.edu.cn
Yuyi MAOHong Kong University of Science and TechnologyVerified email at connect.ust.hk
Dr. Bo BaiTheory Lab, CRI, 2012 Labs, Huawei Technologies Co., Ltd.Verified email at huawei.com
Ying Jun (Angela) ZhangThe Chinese University of Hong Kong; Fellow of IEEEVerified email at ie.cuhk.edu.hk
Justin ChuangASTRIVerified email at astri.org
Yu ZhuFudan UniversityVerified email at fudan.edu.cn
Ranjan K. MallikDepartment of Electrical Engineering, Indian Institute of Technology - DelhiVerified email at ee.iitd.ernet.in
Xianghao YuResearch Assistant Professor, The Hong Kong University of Science and TechnologyVerified email at ust.hk
david huangDepartment of Electrical, Electronic and Compputer Engineering, the University of Western AustraliaVerified email at uwa.edu.au
Chang LiNational Institute of Standards and TechnologyVerified email at connect.ust.hk
Lin DaiCity University of Hong KongVerified email at cityu.edu.hk
Ernest S LoFuture Impact LabVerified email at futureimpactlab.com
Vijay BhargavaElectrical and Computer Engineering, University of British ColumbiaVerified email at ece.ubc.ca