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Co-authors
NG Tsz-WaiCity University of Hong KongVerified email at cityu.edu.hk
Lo Ming-FaiCity University of Hong KongVerified email at cityu.edu.hk
Yafei ZhangShanghai jiaotong Univ.Verified email at sjtu.edu.cn
Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学电子科学与应用物理学院教授)Verified email at hfut.edu.cn
Xiao-Ke LiuAssistant Professor at Linköping UniversityVerified email at liu.se
Ziruo Hong (洪自若)Apple IncVerified email at ucla.edu
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
Ruiqin ZHANGCity University of Hong KongVerified email at cityu.edu.hk
Dapeng YUProfessor of Condensed Matter Physics and Materials Science, Peking UniversityVerified email at pku.edu.cn
Sui-Dong WangProfessor, Institute of Functional Nano & Soft Materials (FUNSOM),Soochow UniversityVerified email at suda.edu.cn
Yuan YaoInstitute of Physics, Chinese Academy of ScienceVerified email at iphy.ac.cn
Shafiq.ICity University of Hong KongVerified email at my.cityu.edu.hk
K W WongVerified email at ust.hk
Zhengwei PanKing Fahd University of Petroleum and Minerals
W.J. ZhangProfessor of Mechanical Engineering and Biomedical Engineering, University of SaskatchewanVerified email at usask.ca

C.S. Lee
Verified email at cityu.edu.hk - Homepage