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- David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- Nancy SottosUniversity of Illinois Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- John A. RogersSimpson/Querrey Professor, Northwestern University在 northwestern.edu 的电子邮件经过验证
- William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University of在 illinois.edu 的电子邮件经过验证
- Huigang ZhangInstitute of Process Engineering, Chinese Academy of Sciences在 ipe.ac.cn 的电子邮件经过验证
- Scott R. WhiteProfessor of Aerospace Engineering, University of Illinois at Urbana-Champaign在 illinois.edu 的电子邮件经过验证
- Jeffrey S. Moorestanley o. ikenberry research professor of chemistry; stanley o. ikenberry endowed chair emeritus在 illinois.edu 的电子邮件经过验证
- James H. PikulUniversity of Wisconsin-Madison在 wisc.edu 的电子邮件经过验证
- Jennifer A. LewisHarvard University在 seas.harvard.edu 的电子邮件经过验证
- Shanhui FanProfessor of Electrical Engineering, Stanford University在 stanford.edu 的电子邮件经过验证
- Florencio Garcia-SantamariaOsram Opto在 osram-os.com 的电子邮件经过验证
- Mark D. LosegoGeorgia Tech在 gatech.edu 的电子邮件经过验证
- Agustin MihiICMAB CSIC Institute of Materials Science of Barcelona在 icmab.es 的电子邮件经过验证
- Seokwoo JeonProfessor at MSE, Korea Univ.在 korea.ac.kr 的电子邮件经过验证
- Gerard C. L. WongUCLA BioE Dept, Chem & Biochem Dept., Microbiology, Immunology, & Mol Genetics Dept, CNSI在 seas.ucla.edu 的电子邮件经过验证
- Michael A. BevanProfessor of Chemical & Biomolecular Engineering, Johns Hopkins University在 jhu.edu 的电子邮件经过验证
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Paul V. Braun
Professor of Materials Science and Engineering, University of Illinois at Urbana-Champaign
在 illinois.edu 的电子邮件经过验证 - 首页