| ML-IDS: A machine learning approach to detect wormhole attacks in Internet of Things P Shukla 2017 Intelligent Systems Conference (IntelliSys), 234-240, 2017 | 132 | 2017 |
| Monolithic 3D Integrated circuits: Recent trends and future prospects K Dhananjay, P Shukla, VF Pavlidis, A Coskun, E Salman IEEE Transactions on Circuits and Systems II: Express Briefs 68 (3), 837-843, 2021 | 23 | 2021 |
| An overview of thermal challenges and opportunities for monolithic 3D ICs P Shukla, AK Coskun, VF Pavlidis, E Salman Proceedings of the 2019 on Great Lakes Symposium on VLSI, 439-444, 2019 | 22 | 2019 |
| PACT: An extensible parallel thermal simulator for emerging integration and cooling technologies Z Yuan, P Shukla, S Chetoui, S Nemtzow, S Reda, AK Coskun IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 14 | 2021 |
| Modeling and optimization of chip cooling with two-phase vapor chambers Z Yuan, G Vaartstra, P Shukla, S Reda, E Wang, AK Coskun 2019 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2019 | 7 | 2019 |
| Two-phase vapor chambers with micropillar evaporators: a new approach to remove heat from future high-performance chips Z Yuan, G Vaartstra, P Shukla, M Said, S Reda, E Wang, AK Coskun 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 7 | 2019 |
| Temperature-aware optimization of monolithic 3D deep neural network accelerators P Shukla, SS Nemtzow, VF Pavlidis, E Salman, AK Coskun Proceedings of the 26th Asia and South Pacific Design Automation Conference …, 2021 | 5 | 2021 |
| A learning-based thermal simulation framework for emerging two-phase cooling technologies Z Yuan, G Vaartstra, P Shukla, Z Lu, E Wang, S Reda, AK Coskun 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE), 400-405, 2020 | 4 | 2020 |
| TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3D Mobile Systems P Shukla, VF Pavlidis, E Salman, AK Coskun IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023 | 2 | 2023 |
| Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads P Shukla, D Aguren, T Burd, AK Coskun, J Kalamatianos 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023 | 1 | 2023 |
| Temperature-Aware Monolithic 3D DNN Accelerators for Biomedical Applications P Shukla, VF Pavlidis, E Salman, AK Coskun arXiv preprint arXiv:2203.15874, 2022 | 1 | 2022 |
| Towards Fast and Accurate Parallel Chip Thermal Simulations with PACT Z Yuan, P Shukla, S Chetoui, C Knox, S Nemtzow, S Reda, AK Coskun Workshop on Open-Source EDA Technology (WOSET), 2021 | 1 | 2021 |
| Temperature-aware 3D-integrated systolic array DNN accelerators P Shukla | | 2023 |
