| Thermal therapy modalities for cancer treatment: A review and future perspectives I Mellal, A Oukaira, E Kengene, A Lakhssassi Appl. Sci. Res. Rev 4 (02), 1-11, 2017 | 43 | 2017 |
| FPGA-embedded smart monitoring system for irrigation decisions based on soil moisture and temperature sensors A Oukaira, AZ Benelhaouare, E Kengne, A Lakhssassi Agronomy 11 (9), 1881, 2021 | 18 | 2021 |
| Thermal management and monitoring based on embedded ring oscillator network sensors for complex system design A Oukaira, I Mellal, O Ettahri, E Kengne, A Lakhssassi Int. J. Comput. Eng. Inf. Technol 9, 127-134, 2017 | 17 | 2017 |
| Modeling and FPGA implementation of a thermal peak detection unit for complex system design A Oukaira, O Ettahri, A Lakhssassi International Journal of Advanced Computer Science and Applications 8 (6), 2017 | 15 | 2017 |
| A real-time thermal monitoring system intended for embedded sensors interfaces O Ettahri, A Oukaira, M Ali, A Hassan, M Nabavi, Y Savaria, A Lakhssassi Sensors 20 (19), 5657, 2020 | 14 | 2020 |
| Foster-based transient thermal analysis of SiP for thermomechanical studies A Oukaira, A Hassan, Y Savaria, A Lakhssassi 2021 19th IEEE International New Circuits and Systems Conference (NEWCAS), 1-4, 2021 | 12 | 2021 |
| Simulation, validation and FPGA implementation of a ring oscillator sensor for thermal management and monitoring A Oukaira, O Ettahri, M Tabaa, S Taheri, A Lakhssassi Procedia Computer Science 155, 83-88, 2019 | 12 | 2019 |
| Simulation and validation of thermal stability for complex system design high power dissipation A Oukaira, S Taheri, M Nour, A Lakhssassi 2017 IEEE International Conference on Smart Energy Grid Engineering (SEGE …, 2017 | 12 | 2017 |
| Simulation and FPGA implementation of thermal convection equation for complex system design A Oukaira, N Pal, O Ettahri, E Kengne, A Lakhssassi IREA) International Journal on Engineering Applications 2 (6), 307-312, 2016 | 12 | 2016 |
| Thermal cooling system development for LabPET II scanners by forced convection flow A Oukaira, R Fontaine, R Lecomte, A Lakhssassi 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS …, 2017 | 11 | 2017 |
| Thermal model development for LabPET II scanner adapter board detector module A Oukaira, A Lakhssassi, R Fontaine, R Lecomte COMSOL Conference 6, 2015 | 10 | 2015 |
| Machine learning and game-theoretic model for advanced wind Energy management protocol (AWEMP) I Khabbouchi, D Said, A Oukaira, I Mellal, L Khoukhi Energies 16 (5), 2179, 2023 | 9 | 2023 |
| Towards real-time monitoring of thermal peaks in systems-on-chip (SoC) A Oukaira, A Hassan, M Ali, Y Savaria, A Lakhssassi Sensors 22 (15), 5904, 2022 | 9 | 2022 |
| Thermo-mechanical analysis and fatigue life prediction for integrated circuits (ics) A Oukaira, DE Touati, A Hassan, M Ali, Y Savaria, A Lakhssassi 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS …, 2021 | 9 | 2021 |
| Transient thermal analysis of system-in-package technology by the finite element method (FEM) A Oukaira, D Said, J Zbitou, A Lakhssassi 2022 International Conference on Microelectronics (ICM), 30-33, 2022 | 7 | 2022 |
| IWSN under an industrial wireless channel in the context of Industry 4.0 S Saadaoui, M Tabaa, F Monteiro, M Chehaitly, A Dandache, A Oukaira 2017 29th International Conference on Microelectronics (ICM), 1-4, 2017 | 7 | 2017 |
| Advanced thermal control using chip cooling laminate chip (CCLC) with finite element method for system-in-package (SiP) technology A Oukaira, D Said, J Zbitou, A Lakhssassi Electronics 12 (14), 3154, 2023 | 6 | 2023 |
| FEM-based thermal profile prediction for thermal management of system-on-chips A Oukaira, DE Touati, A Hassan, M Ali, Y Savaria, A Lakhssassi 2022 8th International Conference on Optimization and Applications (ICOA), 1-4, 2022 | 6 | 2022 |
| Thermal damage modeling analysis and validation during treatment of tissue tumors M Nour, A Oukaira, M Bougataya, A Lakhssassi International Journal of Pharma Medicine and Biological Sciences 6 (4), 98-104, 2017 | 6 | 2017 |
| Finite element method for system-in-package (sip) technology: Thermal analysis using chip cooling laminate chip (cclc) A Oukaira, D Said, J Zbitou, A Lakhssassi 2023 17th International Conference on Ubiquitous Information Management and …, 2023 | 5 | 2023 |
Ahmed LakhssassiAhmed Lakhssassi,Verified email at uqo.ca
