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Kevin Drummond
Kevin Drummond
Product Design Engineer, Gentex Corporation
Verified email at gentex.com
Title
Cited by
Cited by
Year
A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
KP Drummond, D Back, MD Sinanis, DB Janes, D Peroulis, JA Weibel, ...
International Journal of Heat and Mass Transfer 117, 319-330, 2018
2782018
Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
KP Drummond, D Back, MD Sinanis, DB Janes, D Peroulis, JA Weibel, ...
International Journal of Heat and Mass Transfer 126, 1289-1301, 2018
1112018
Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array
KP Drummond, JA Weibel, SV Garimella, D Back, DB Janes, MD Sinanis, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
642016
Design, fabrication, and characterization of a compact hierarchical manifold microchannel heat sink array for two-phase cooling
D Back, KP Drummond, MD Sinanis, JA Weibel, SV Garimella, D Peroulis, ...
IEEE transactions on components, packaging and manufacturing technology 9 (7 …, 2019
462019
Two-phase flow morphology and local wall temperatures in high-aspect-ratio manifold microchannels
KP Drummond, JA Weibel, SV Garimella
International Journal of Heat and Mass Transfer 153, 119551, 2020
372020
Experimental study of flow boiling in a compact hierarchical manifold microchannel heat sink array
KP Drummond, JA Weibel, SV Garimella
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017
92017
Thermal Characterization of Graphitic Carbon Foams for Use in Thermal Storage Applications
KP Drummond
Ohio University, 2012
42012
Thermal modeling of vapor chamber heat spreaders and model validation
PR Parida, K Marston, K Drummond, L Campbell, Y Saito, TL Phan, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
22020
Characterization of manifold microchannel heat sinks during two-phase operation
KP Drummond
Purdue University, 2018
22018
Measurement of thermal conductivity of graphitic foams
K Drummond, K Alam
Developments in Strategic Materials and Computational Design III, 183-191, 2012
22012
Cooling potential of vortex tubes for chip hot spot cooling
K Drummond, K Sikka
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
12017
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste
CL Arvin, K Drummond, L Del Carro, T Brunschwiler, S Allard, KC Marston, ...
US Patent 11,164,804, 2021
2021
Localized catalyst for enhanced thermal interface material heat transfer
CL Arvin, K Drummond, KC Marston, C Muzzy, S Iruvanti
US Patent 11,152,282, 2021
2021
Structure with controlled capillary coverage
K Drummond, T Lombardi, S Ostrander, S Allard, C Dufort
US Patent 11,152,226, 2021
2021
Computer system with modified module socket
CL Arvin, MK Hoffmeyer, K Drummond, C Muzzy
US Patent 10,993,324, 2021
2021
Laurldsen, EM, 127 Leyssale, J.-M., 105 Low, M., 151
W Ludwig, HA Colorado, CEJ Dancer, V De La Prida, C Descamps, ...
Developments in Strategic Materials and Computational Design III, 201, 2013
2013
Session3: Concurrent Design/LED
K Drummond, R Kenney
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