A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics KP Drummond, D Back, MD Sinanis, DB Janes, D Peroulis, JA Weibel, ... International Journal of Heat and Mass Transfer 117, 319-330, 2018 | 278 | 2018 |
Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions KP Drummond, D Back, MD Sinanis, DB Janes, D Peroulis, JA Weibel, ... International Journal of Heat and Mass Transfer 126, 1289-1301, 2018 | 111 | 2018 |
Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array KP Drummond, JA Weibel, SV Garimella, D Back, DB Janes, MD Sinanis, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 64 | 2016 |
Design, fabrication, and characterization of a compact hierarchical manifold microchannel heat sink array for two-phase cooling D Back, KP Drummond, MD Sinanis, JA Weibel, SV Garimella, D Peroulis, ... IEEE transactions on components, packaging and manufacturing technology 9 (7 …, 2019 | 46 | 2019 |
Two-phase flow morphology and local wall temperatures in high-aspect-ratio manifold microchannels KP Drummond, JA Weibel, SV Garimella International Journal of Heat and Mass Transfer 153, 119551, 2020 | 37 | 2020 |
Experimental study of flow boiling in a compact hierarchical manifold microchannel heat sink array KP Drummond, JA Weibel, SV Garimella 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017 | 9 | 2017 |
Thermal Characterization of Graphitic Carbon Foams for Use in Thermal Storage Applications KP Drummond Ohio University, 2012 | 4 | 2012 |
Thermal modeling of vapor chamber heat spreaders and model validation PR Parida, K Marston, K Drummond, L Campbell, Y Saito, TL Phan, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 2 | 2020 |
Characterization of manifold microchannel heat sinks during two-phase operation KP Drummond Purdue University, 2018 | 2 | 2018 |
Measurement of thermal conductivity of graphitic foams K Drummond, K Alam Developments in Strategic Materials and Computational Design III, 183-191, 2012 | 2 | 2012 |
Cooling potential of vortex tubes for chip hot spot cooling K Drummond, K Sikka 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 1 | 2017 |
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste CL Arvin, K Drummond, L Del Carro, T Brunschwiler, S Allard, KC Marston, ... US Patent 11,164,804, 2021 | | 2021 |
Localized catalyst for enhanced thermal interface material heat transfer CL Arvin, K Drummond, KC Marston, C Muzzy, S Iruvanti US Patent 11,152,282, 2021 | | 2021 |
Structure with controlled capillary coverage K Drummond, T Lombardi, S Ostrander, S Allard, C Dufort US Patent 11,152,226, 2021 | | 2021 |
Computer system with modified module socket CL Arvin, MK Hoffmeyer, K Drummond, C Muzzy US Patent 10,993,324, 2021 | | 2021 |
Laurldsen, EM, 127 Leyssale, J.-M., 105 Low, M., 151 W Ludwig, HA Colorado, CEJ Dancer, V De La Prida, C Descamps, ... Developments in Strategic Materials and Computational Design III, 201, 2013 | | 2013 |
Session3: Concurrent Design/LED K Drummond, R Kenney | | |