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Co-authors
Abhijit PramanickGroup of Electrical and Electronic Engineers, Paris, University Paris-Saclay, Gif-sur-Yvette, FranceVerified email at centralesupelec.fr- Derek HoAssociate Professor, Materials Science and Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Bo JiaoXi'an Jiaotong universityVerified email at mail.xjtu.edu.cn
- Weitong LinCity University of Hong KongVerified email at my.cityu.edu.hk
- Alisa R. PatersonResearch Officer, Sylvia Fedoruk Canadian Centre for Nuclear InnovationVerified email at fedorukcentre.ca
- Olaf BorkiewiczBeamline Scientist, X-ray Science Division, Argonne National LaboratoryVerified email at anl.gov
- Jacob L. JonesMaterials Science & Engineering, North Carolina State UniversityVerified email at ncsu.edu
- Gang NiuXi'an Jiaotong UniversityVerified email at mail.xjtu.edu.cn
- Jinyan ZhaoXi'an Jiaotong UniversityVerified email at xjtu.edu.cn
- Susan Trolier-McKinstrySteward S. Flaschen Professor of Ceramic Science and Engineering and Electrical Eng., Penn StateVerified email at psu.edu
- Yang RenCity University of Hong Kong & Argonne National LaboratoryVerified email at cityu.edu.hk
