| Evaluation of Near-Field Undesired Radio Waves from Semiconductor Switching Circuits M Nagata, K Watanabe, Y Sugimoto, N Miura, S Tanaka, Y Miyazawa, ... 2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019 | 10 | 2019 |
| Evaluation of Undesired Radio Waves Below− 170 dBm/Hz From Semiconductor Switching Devices for Impact on Wireless Communications K Watanabe, Y Sugimoto, S Tanaka, N Miura, M Nagata, Y Miyazawa, ... IEEE Letters on Electromagnetic Compatibility Practice and Applications 1 (3 …, 2019 | 7 | 2019 |
| Measurements of Electromagnetic Emission nearby a Compact Drone K Watanabe, M Aoi, M Komatsu, S Tanaka, M Nagata 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2021 | 6 | 2021 |
| Measurements of Electromagnetic Emission inside Industrial Unmanned Aerial Vehicles K Watanabe, M Aoi, M Komatsu, S Tanaka, M Nagata 2021 13th International Workshop on the Electromagnetic Compatibility of …, 2022 | 4 | 2022 |
| Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels K Watanabe, K Jike, S Tanaka, N Miura, M Nagata, A Takahashi, ... 2019 12th International Workshop on the Electromagnetic Compatibility of …, 2019 | 4 | 2019 |
| Analysis of Electromagnetic Noise From Switching Power Modules Using Wide Band Gap Semiconductors K Watanabe, M Komatsu, M Aoi, R Sakai, S Tanaka, M Nagata IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (4 …, 2022 | 3 | 2022 |
| Impact of Emission Noise and Electromagnetic Shielding on Mobile Communication Systems in Unmanned Aerial Vehicles R Sakai, K Watanabe, S Ashida, H Uehara, S Tanaka, M Nagata 2023 International Symposium on Electromagnetic Compatibility–EMC Europe, 1-4, 2023 | 2 | 2023 |
| Near Field Measurements of Sub-millimeter-wave Noise Emission from Digital Integrated Circuits K Watanabe, T Wadatsumi, K Monta, M Aoi, M Komatsu, R Sakai, ... 2021 13th International Workshop on the Electromagnetic Compatibility of …, 2022 | 1 | 2022 |
| Sintered Ferrite Thin Plate Noise Suppressor Mounted on IC Chip Interposer M Yamaguchi, A Takahashi, Y Miyazawa, K Watanabe, K Jike, S Tanaka, ... 2019 12th International Workshop on the Electromagnetic Compatibility of …, 2019 | 1 | 2019 |
| Synopsis of L-EMCPA December 2022 issue K Watanabe, M Komatsu, M Aoi, R Sakai, S Tanaka, M Nagata, D Izzo, ... IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (4 …, 2022 | | 2022 |
| Time Domain Analysis of Emission Noise from Drone and Evaluation of Interference with Cellular Systems. R Sakai, K Watanabe, S Tanaka, M Nagata IEICE Technical Report; IEICE Tech. Rep. 122 (67), 11-14, 2022 | | 2022 |
| Noise Evaluation nearby a Compact Drone K Watanabe, M Aoi, M Komatsu, S Tanaka, M Nagata IEICE Technical Report; IEICE Tech. Rep. 121 (81), 30-33, 2021 | | 2021 |
| Evaluation of Wide Band Emission Noise from Power Module Using GaN Elements M Komatsu, KO WATANABE, M Aoi, S Tanaka, M Nagata 電子情報通信学会技術研究報告 (Web) 120 (333 (EMCJ2020 64-71)), 35-39, 2021 | | 2021 |
| Noise Suppression with Magnetic Composite Sheets in IC chip packaging and Improvements of Wireless Communication Performance K Watanabe, K Jike, S Tanaka, N Miura, M Nagata, A Takahashi, ... IEICE Technical Report; IEICE Tech. Rep. 119 (241), 175-178, 2019 | | 2019 |
| Evaluation of IC-Chip Noise Reduction using Magnetic Materials K Jike, K Watanabe, S Tanaka, N Miura, M Nagata, A Takahashi, ... IEICE Technical Report; IEICE Tech. Rep. 119 (162), 79-83, 2019 | | 2019 |
| Analysis of Conductive Power Noise Characteristics in Digital IC Chips between two Different IC Packaging Structures A Tsukioka, K Jike, K Watanabe, N Miura, M Nagata IEICE Technical Report; IEICE Tech. Rep. 118 (337), 37-42, 2018 | | 2018 |
| Electromagnetic radiation by IC chip and evaluation of mobile communication interference Y Sugimoto, K Watanabe, M Nagata, N Miura, Y Miyazawa, S Tanaka, ... IEICE Technical Report; IEICE Tech. Rep. 118 (317), 31-33, 2018 | | 2018 |
| Evaluation of the influence of high-order harmonic noise from digital circuits on mobile communications Y Sugimoto, K Watanabe, N Miura, M Nagata, Y Miyazawa, S Tanaka, ... IEICE Technical Report; IEICE Tech. Rep. 117 (243), 95-98, 2017 | | 2017 |
| Evaluation of Wide Band Emission Noise from Power Modules using Wide Bandgap Semiconductors K Watanabe, R Sakai, S Tanaka, M Nagata IEICE Technical Report; IEICE Tech. Rep., 0 | | |
| Impact of Electromagnetic Emission from Switching Power Modules on 5G Communication Systems K Watanabe, M Komatsu, M Aoi, R Sakai, S Tanaka, M Nagata IEICE Technical Report; IEICE Tech. Rep., 0 | | |
Makoto NagataProfessor, Kobe UniversityVerified email at cs.kobe-u.ac.jp
