| Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors RS Sivasubramony, N Adams, M Alhendi, GS Khinda, MZ Kokash, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 896-903, 2018 | 22 | 2018 |
| A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes P Borgesen, L Wentlent, T Alghoul, R Sivasubramony, M Yadav, ... Microelectronics Reliability 95, 65-73, 2019 | 16 | 2019 |
| Understanding and preventing Cu–Sn micro joint defects through design and process control M Njuki, S Thekkut, R Das, N Shahane, P Thompson, K Mirpuri, ... Journal of Applied Electrochemistry, 1-13, 2022 | 14 | 2022 |
| Enhanced voiding in Cu-Sn micro joints M Njuki, S Thekkut, R Sivasubramony, CM Greene, N Shahane, ... Materials Research Bulletin 150, 111759, 2022 | 11 | 2022 |
| Strength and isothermal fatigue resistance of SnBi/SnAgCu joints reflowed at low temperatures M Yadav, T Alghoul, S Thekkut, R Das, C Greene, P Borgesen, ... Journal of Electronic Packaging 144 (3), 031001, 2022 | 10 | 2022 |
| Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds RS Sivasubramony, MZ Kokash, S Thekkut, N Shahane, P Thompson, ... Journal of Electronic Packaging 144 (1), 011007, 2022 | 9 | 2022 |
| Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020 | 7 | 2020 |
| Preventing Void Growth Between Ni3Sn4 and Solder M Njuki, S Thekkut, R Das, P Borgesen, N Dimitrov Journal of Electronic Materials 51 (11), 6333-6346, 2022 | 6 | 2022 |
| Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds S Thekkut, MZ Kokash, RS Sivasubramony, Y Kawana, K Mirpuri, ... Journal of Electronic Packaging 144 (3), 031009, 2022 | 6 | 2022 |
| Aging and fatigue of aerosol jet-printed nano-Ag traces on flexible substrate A Raj, RS Sivasubramony, M Yadav, S Thekkut, GS Khinda, M Alhendi, ... Journal of Electronic Packaging 143 (2), 021006, 2021 | 6 | 2021 |
| Effective Constitutive Relations for Sintered Nano Copper Joints S Thekkut, RS Sivasubramony, A Raj, Y Kawana, J Assiedu, K Mirpuri, ... Journal of Electronic Packaging 145 (2), 021010, 2023 | 5 | 2023 |
| Damage accumulation in printed interconnects on flex under combinations of bending and tension with different amplitudes MDP R. S. Sivasubramony, M. Alhendi, M. Kokash, M. Yadav, A. Raj, S. Thekkut ... 70th Electronic Components and Technology Conference (ECTC)., 2020 | 3* | 2020 |
| Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor TM Alghoul, M Yadav, S Thekkut, RS Sivasubramony, CM Greene, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 948-953, 2018 | 3 | 2018 |
| Early transient creep of single crystal SnAgCu solder joints R Das, S Thekkut, RS Sivasubramony, T Alghoul, A Mahmood, S Joshi, ... Journal of Materials Science: Materials in Electronics 33 (17), 13657-13667, 2022 | 2 | 2022 |
| Mechanistic Understanding of Sintered Nano Copper Based Joints S Thekkut State University of New York at Binghamton, 2022 | 1 | 2022 |
| Factors Controlling the Defect Formation in Cu-Sn Micro Joints in 2.5 D and 3D Interconnects M Njuki, S Thekkut, P Borgesen, N Dimitrov Electrochemical Society Meeting Abstracts 240, 930-930, 2021 | 1 | 2021 |
| Reliable Low-Temperature Solder Approach with Sn-Ag-Cu/Sn-Bi S Malwade State University of New York at Binghamton, 2021 | 1 | 2021 |
| A mechanistic model for the life of solder joints under realistic long-term service conditions P Borgesen, L Wentlent, T Alghoul, S Joshi, R Sivasubramony, M Yadav, ... 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 1 | 2018 |
| Mechanistic Picture of Tensile Fatigue of Nano Porous Silver Traces on Flexible Substrate A Raj State University of New York at Binghamton, 2021 | | 2021 |
| Damage Accumulation Behavior in Tin-Lead Solder Joints During Isothermal Cycling S Thekkut State University of New York at Binghamton, ProQuest Dissertations …, 2018 | | 2018 |
Peter BorgesenProfessor of Systems Science & Industrial Engineering, Binghamton UniversityVerified email at binghamton.edu
