| Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for … Z Sun, R Wong, M Yu, J Li, M Zhang, L Mele, J Hah, M Kathaperumal, ... Chemical Engineering Journal 439, 135621, 2022 | 32 | 2022 |
| Atomic Modulation of 3D Conductive Frameworks Boost Performance of MnO2 for Coaxial Fiber-Shaped Supercapacitors X Wang, Z Zhou, Z Sun, J Hah, Y Yao, KS Moon, J Di, Q Li, C Wong Nano-Micro Letters 13, 1-12, 2021 | 31 | 2021 |
| Towards a better understanding of the forming and resistive switching behavior of Ti-doped HfO x RRAM FF Athena, MP West, J Hah, R Hanus, S Graham, EM Vogel Journal of Materials Chemistry C 10 (15), 5896-5904, 2022 | 24 | 2022 |
| Processing and characterization of silver-filled conductive polysulfide sealants for aerospace applications B Song, J Li, F Wu, S Patel, J Hah, X Wang, K Moon, CP Wong Soft matter 14 (44), 9036-9043, 2018 | 19 | 2018 |
| Impact of titanium doping and pulsing conditions on the analog temporal response of hafnium oxide based memristor synapses FF Athena, MP West, P Basnet, J Hah, Q Jiang, WC Lee, EM Vogel Journal of Applied Physics 131 (20), 2022 | 13 | 2022 |
| Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes J Hah, Y Kim, P Fernandez-Zelaia, S Hwang, S Lee, L Christie, P Houston, ... Materialia 6, 100327, 2019 | 13 | 2019 |
| Impact of oxygen concentration at the HfOx/Ti interface on the behavior of HfOx filamentary memristors J Hah, MP West, FF Athena, R Hanus, EM Vogel, S Graham Journal of Materials Science 57 (20), 9299-9311, 2022 | 10 | 2022 |
| Design and surface modification of PET substrates using UV/ozone treatment for roll-to-roll processed solar photovoltaic (PV) module packaging J Hah, B Song, KS Moon, S Graham, CP Wong 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2397-2403, 2018 | 9 | 2018 |
| Polyimide incorporated cyanate ester/epoxy copolymers for high‐temperature molding compounds F Wu, B Song, J Hah, CC Tuan, KS Moon, CP Wong Journal of Polymer Science Part A: Polymer Chemistry 56 (21), 2412-2421, 2018 | 8 | 2018 |
| Surface modification of backsheets using coupling agents for roll-to-roll processed thin-film solar photovoltaic (PV) module packaging application J Hah, M Sulkis, M Kang, Z Sun, J Kim, KS Moon, MO Reese, CP Wong ACS Applied Materials & Interfaces 13 (1), 1682-1692, 2020 | 6 | 2020 |
| Uniform metal-assisted chemical etching and the stability of catalysts L Li, CM Holmes, J Hah, OJ Hildreth, CP Wong MRS Online Proceedings Library (OPL) 1801, 1-8, 2015 | 5 | 2015 |
| Progress, challenges, and further trends of all perovskites tandem solar cells: A comprehensive review QQ Chu, Z Sun, J Hah, K Moon, B Cheng, D Wang, P Xiao, Y Zhou, ... Materials Today, 2023 | 4 | 2023 |
| Trade-off between Gradual Set and On/Off Ratio in HfOx-Based Analog Memory with a Thin SiOx Barrier Layer FF Athena, MP West, J Hah, S Graham, EM Vogel ACS Applied Electronic Materials 5 (6), 3048-3058, 2023 | 4 | 2023 |
| Microstructures of Pb-free solder joints by reflow and thermo-compression bonding (TCB) processes Y Kim, J Hah, P Fernandez-Zelaia, S Lee, L Christie, P Houston, ... 2019 IEEE 69th Electronic Components and Technology Conference (Ectc), 2349-2358, 2019 | 4 | 2019 |
| Comparison of two high temperature treatment methods on preparing electrically conductive polysulfide/Ag composites for aerospace sealant applications J Li, B Song, D An, Y Ren, J Hah, X Wang, R Zhang, K Moon, CP Wong Journal of Applied Polymer Science 138 (13), 50121, 2021 | 2 | 2021 |
| Novel Decapsulation Method for Silver-Based Wire-Bond Semiconductor Packages With High Reliability Using Mixed Salt–Acid Chemistry YJ Kim, J Hah, KS Moon, CP Wong IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019 | 2 | 2019 |
| Moisture Barrier, Mechanical, and Thermal Properties of PDMS-PIB Blends for Solar Photovoltaic (PV) Module Encapsulant J Hah, M Sulkis, C Ren, M Kang, K Moon, S Graham, CP Wong 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1977-1982, 2019 | 2 | 2019 |
| Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages YJ Kim, J Hah, KS Moon, CP Wong 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2359-2364, 2019 | 2 | 2019 |
| Encapsulation and design of scalable packaging materials for thin film perovskite solar cell applications J Hah Georgia Institute of Technology, 2019 | | 2019 |
