| Pb-free solders for flip-chip interconnects DR Frear, JW Jang, JK Lin, C Zhang Jom 53 (6), 28-33, 2001 | 447 | 2001 |
| Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology JW Jang, PG Kim, KN Tu, DR Frear, P Thompson Journal of Applied Physics 85 (12), 8456-8463, 1999 | 326 | 1999 |
| Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5 Ag, Sn–3.8 Ag–0.7 Cu and Sn–0.7 Cu) on Cu TY Lee, WJ Choi, KN Tu, JW Jang, SM Kuo, JK Lin, DR Frear, K Zeng, ... Journal of Materials Research 17 (2), 291-301, 2002 | 318 | 2002 |
| Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization JW Jang, DR Frear, TY Lee, KN Tu Journal of Applied Physics 88 (11), 6359-6363, 2000 | 223 | 2000 |
| Wetting reaction versus solid state aging of eutectic SnPb on Cu KN Tu, TY Lee, JW Jang, L Li, DR Frear, K Zeng, JK Kivilahti Journal of applied physics 89 (9), 4843-4849, 2001 | 169 | 2001 |
| Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils PG Kim, JW Jang, TY Lee, KN Tu Journal of Applied Physics 86 (12), 6746-6751, 1999 | 162 | 1999 |
| Roles of Ba/Ti Ratios in the Dielectric Properties of BaTiO3 Ceramics JK Lee, KS Hong, JW Jang Journal of the American Ceramic Society 84 (9), 2001-2006, 2001 | 158 | 2001 |
| Characterization of lead-free solders and under bump metallurgies for flip-chip package JK Lin, A De Silva, D Frear, Y Guo, S Hayes, JW Jang, L Li, D Mitchell, ... IEEE Transactions on Electronics Packaging Manufacturing 25 (4), 300-307, 2002 | 93 | 2002 |
| Anatase-to-rutile transition of titania thin films prepared by MOCVD C Byun, JW Jang, IT Kim, KS Hong, BW Lee Materials Research Bulletin 32 (4), 431-440, 1997 | 86 | 1997 |
| Low-temperature formation of α-alumina by doping of an alumina-sol HJ Youn, JW Jang, IT Kim, KS Hong Journal of colloid and interface science 211 (1), 110-113, 1999 | 78 | 1999 |
| Thickness dependence of room temperature permittivity of polycrystalline thin films by radio-frequency magnetron sputtering JW Jang, SJ Chung, WJ Cho, TS Hahn, SS Choi Journal of applied physics 81 (9), 6322-6327, 1997 | 74 | 1997 |
| Spalling of intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing JW Jang, LN Ramanathan, JK Lin, DR Frear Journal of applied physics 95 (12), 8286-8289, 2004 | 73 | 2004 |
| High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films JW Jang, PG Kim, KN Tu, M Lee Journal of materials research 14, 3895-3900, 1999 | 63 | 1999 |
| Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5 Ag solder B Yeung, JW Jang Journal of Materials Science Letters 21 (9), 723-726, 2002 | 50 | 2002 |
| Ferroelastic twins in LaAlO3 polycrystals CH Kim, JW Jang, SY Cho, IT Kim, KS Hong Physica B: Condensed Matter 262 (3-4), 438-443, 1999 | 47 | 1999 |
| Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy SH Park, JW Jang, HS Kim Journal of Micromechanics and Microengineering 25 (9), 095007, 2015 | 44 | 2015 |
| Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy LN Ramanathan, JW Jang, JK Lin, DR Frear Journal of electronic materials 34, L43-L46, 2005 | 41 | 2005 |
| Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn–3.8 Ag–0.7 Cu and eutectic SnPb solders JW Jang, AP De Silva, JE Drye, SL Post, NL Owens, JK Lin, DR Frear IEEE transactions on electronics packaging manufacturing 30 (1), 49-53, 2007 | 40 | 2007 |
| Interfacial morphology and shear deformation of flip chip solder joints JW Jang, CY Liu, PG Kim, KN Tu, AK Mal, DR Frear Journal of Materials Research 15, 1679-1687, 2000 | 36 | 2000 |
| Low temperature synthesis of PbTiO3 thin films by MOCVD without carrier gas C Byun, JW Jang, YJ Cho, KJ Lee, BW Lee Thin solid films 324 (1-2), 94-100, 1998 | 36 | 1998 |
