| Measurement and modeling of the effective thermal conductivity of sintered silver pastes J Ordonez-Miranda, M Hermens, I Nikitin, VG Kouznetsova, ... International Journal of Thermal Sciences 108, 185-194, 2016 | 45 | 2016 |
| Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation B Wunderle, M Klein, L Dietrich, MA Ras, R Mrossko, D May, R Schacht, ... 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 22 | 2010 |
| Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples C Grosse, MA Ras, A Varpula, K Grigoras, D May, B Wunderle, ... Sensors and Actuators A: Physical 278, 33-42, 2018 | 21 | 2018 |
| In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features B Wunderle, J Kleff, R Mrossko, MA Ras, D May, R Schacht, ... 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 21 | 2008 |
| Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates M AboRas, D May, R Schacht, T Winkler, S Rzepka, B Michel, B Wunderle Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 17 | 2014 |
| Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials MA Ras, B Wunderle, D May, H Oppermann, R Schacht, B Michel 2010 16th International Workshop on Thermal Investigations of ICs and …, 2010 | 14 | 2010 |
| " LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials MA Ras, D May, R Schacht, M Bast, R Eisele, B Michel, T Winkler, ... 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 13 | 2015 |
| Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials M AboRas, R Haug, R Schacht, C Monory-Plantier, D May, B Wunderle, ... | 13 | 2011 |
| Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography D May, B Wunderle, MA Ras, W Faust, A Gollhard, R Schacht, B Michel 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 13 | 2008 |
| Effect of different deconvolution methods on structure function calculation KA Pareek, C Grosse, M Sternberg, D May, MA Ras, B Wunderle 2020 26th International Workshop on Thermal Investigations of ICs and …, 2020 | 12 | 2020 |
| Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials M AboRas, B Wunderle, D May, R Schacht, T Winkler, S Rzepka, B Michel 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 12 | 2014 |
| Volume imaging NDE and serial sectioning of carbon fiber composites I Hakim, D Schumacher, V Sundar, S Donaldson, A Creuz, R Schneider, ... AIP Conference Proceedings 1949 (1), 2018 | 11 | 2018 |
| An in-line failure analysis system based on IR thermography ready for production line integration DR Wargulski, D May, F Löffler, T Nowak, J Petrick, C Grosse, B Wunderle, ... 2019 25th International Workshop on Thermal Investigations of ICs and …, 2019 | 10 | 2019 |
| Accelerated pump out testing for thermal greases B Wunderle, D May, J Heilmann, J Arnold, J Hirscheider, Y Li, J Bauer, ... 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 10 | 2019 |
| Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization M AboRas, G Engelmann, D May, M Rothermund, R Schacht, B Wunderle, ... 19th International Workshop on Thermal Investigations of ICs and Systems …, 2013 | 10 | 2013 |
| Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials M Abo Ras, B Wunderle, D May, H Oppermann, R Schacht, B Michel | 10 | 2010 |
| Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography DR Wargulski, B Rabay, A Stelzer, J Rudzki, A Hindel, M Bast, D Busse, ... 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 9 | 2019 |
| Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test B Wunderle, CA Manier, MA Ras, M Springborn, D May, H Oppermann, ... 19th International Workshop on Thermal Investigations of ICs and Systems …, 2013 | 9 | 2013 |
| Towards data driven failure analysis using infrared thermography KA Pareek, D May, MA Ras, B Wunderle 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics …, 2021 | 8 | 2021 |
| Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation DR Wargulski, D May, C Grosse-Kockert, E Boschman, MA Ras, ... 15th Quantitative InfraRed Thermography Conference, 21-30, 2020 | 8 | 2020 |
