| Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study D Hu, Z Cui, J Fan, X Fan, G Zhang Results in Physics 19, 103486, 2020 | 26 | 2020 |
| Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis H Tang, D Hu, Z Cui, H Ye, G Zhang The Journal of Physical Chemistry C 125 (4), 2680-2690, 2021 | 16 | 2021 |
| High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging J Fan, D Jiang, H Zhang, D Hu, X Liu, X Fan, G Zhang Results in Physics 33, 105168, 2022 | 14 | 2022 |
| Influence of plastic strain localisation on the mechanical properties of metal matrix composites G Fan, H Wu, L Geng, Z Zheng, X Cui, D Hu Philosophical Magazine Letters 97 (6), 241-248, 2017 | 12 | 2017 |
| Low power AlGaN/GaN MEMS pressure sensor for high vacuum application J Sun, D Hu, Z Liu, LM Middelburg, S Vollebregt, PM Sarro, G Zhang Sensors and Actuators A: Physical 314, 112217, 2020 | 9 | 2020 |
| Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study D Hu, T Gu, Z Cui, S Vollebregt, X Fan, G Zhang, J Fan Corrosion Science 192, 109846, 2021 | 8 | 2021 |
| Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip R Sattari, D Hu, X Liu, H van Zeijl, S Vollebregt, G Zhang Applied Thermal Engineering 221, 119503, 2023 | 7 | 2023 |
| High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling D Hu, C Qian, X Liu, L Du, Z Sun, X Fan, G Zhang, J Fan journal of materials research and technology 26, 3183-3200, 2023 | 5 | 2023 |
| Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation Z Cui, Y Zhang, D Hu, S Vollebregt, J Fan, X Fan, G Zhang Journal of Physics: Condensed Matter 34 (17), 175401, 2022 | 4 | 2022 |
| Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging R Luo, D Hu, C Qian, X Liu, X Fan, G Zhang, J Fan Microelectronics Reliability 152, 115284, 2024 | 3 | 2024 |
| Study on sintering mechanism and mechanical properties of nano-Cu based on molecular dynamics simulation C Qian, D Hu, X Liu, X Fan, G Zhang, J Fan 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 2 | 2023 |
| Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices L Du, D Hu, R Poelm, W Van Driel, K Zhang 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 1 | 2023 |
| Patterning of fine-features in nanoporous films synthesized by spark ablation X Ji, HJ van Ginkel, D Hu, A Schmidt-Ott, H van Zeijl, S Vollebregt, ... 2022 IEEE 22nd International Conference on Nanotechnology (NANO), 238-241, 2022 | 1 | 2022 |
| Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging D Hu, L Du, M Alfreider, J Fan, D Kiener, G Zhang Materials Science and Engineering: A 897, 146316, 2024 | | 2024 |
| Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging W Chen, X Liu, D Hu, X Zhu, X Fan, G Zhang, J Fan Materials & Design 238, 112702, 2024 | | 2024 |
| Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application D Hu, MB Shah, J Fan, S Vollebregt, G Zhang IEEE Transactions on Electron Devices, 2023 | | 2023 |
| Evolution mechanism of low-temperature sintering of Cu nanoparticle paste D Hu | | 2019 |
