| Marginal failure diagnosed with LADA—case studies S Lee, K Kim, Y Lee, E Lee, Y Kim, I Kapilevich ISTFA 2014, 358-364, 2014 | 7 | 2014 |
| New Failure Analysis Method for Laser Voltage Probing (LVP) Utilizing System Evaluation Board and Software SH Lee, YW Lee, MJ Hong, SJ Yun, EC Lee, KS Hong ISTFA2011, 439, 2011 | 5 | 2011 |
| Case Study: Failure analysis of functional shmoo hole with Laser Voltage Probing YW SHLee, KT Lee, CY Choi, HW Shin, YS Ng, TR Lundquist ISTFA 2009: Conference Proceedings from the 35th International Symposium for …, 2009 | 4 | 2009 |
| Interpreting laser-based fault localization results: Case studies S Lee, J van den Biggelaar, M van Veenhuizen ISTFA 2019, 168-172, 2019 | 1 | 2019 |
| Complementary Fault Isolation Procedures Combining Laser Voltage Probing/Imaging and Lock-In Thermography—Case Studies S Lee, M van Veenhuizen ISTFA 2022, 369-373, 2022 | | 2022 |
| Unlocking Novel FA Case Studies Using a Lock-in Amplifier S Lee, M van Veenhuizen, P Navaretti, G Donati ISTFA 2020, 253-260, 2020 | | 2020 |
| The Use of a Fresnel Lens on an Actual Failure M van Veenhuizen, H Kerver, L Peters-Wu, S Lee, F Zachariasse ISTFA 2016, 272-281, 2016 | | 2016 |
| Laser Stimulation Effect on FinFET and Case Study K Jin, S Lee, K Kim, Y Lee, Y Kim ISTFA 2015, 241-244, 2015 | | 2015 |
| Simple and Effective Technique of Backside Deprocessing of Thin Flip Chip Package SH Lee, CH Park, SJ Cha, EC Lee, KS Hong ISTFA 2013, 501-504, 2013 | | 2013 |
